Замечания:1 创始人: Site Editor Publish Time: 2025-04-22 Origin: Веб - сайт
BGA
Detailed Explanation and Rework Tips
1. Basic knowledge: BGA (Ball Grid Array
Package) technology involves placing circular or cylindrical solder joints in
an array on the bottom of the chip. Unlike traditional chip packaging, BGA
packaging is unique in that its solder joints are completely hidden under the
chip, which gives it the following advantages:
Higher density pinouts
Better electrothermal performance
Complex rework process
2.1 PBGA (Plastic Package)
Advantages: low cost, easy processing
○ Features:
• Melting point of conventional solder:
183°C for leaded type and 217°C for lead-free type.
Pay attention to moisture
2.2 CBGA
Advantages: moisture-proof, stable
○ Features:
High melting point solder balls (90%
lead and 10% tin)
The diameter of the solder ball is
0.889mm
No solder residue.
[Analysis of the repair process]
1. Key steps of rework 3.1 Preparation
for pretreatment - pay attention to the tip: the preparation at this stage will
be directly related to the efficiency of the rework job!
Drying process (key link):
CRITICAL STEP: Be sure to thoroughly
remove residual moisture from the chip and board
○ Operation Specifications:
After baking, the follow-up process is
completed within 24 hours.
• Temperature-sensitive components, such
as batteries and optical fibers, must be removed beforehand.
Protective measures:
The repair area must be protected within
10mm.
• Seal with 5-6 layers of
high-temperature tape
• Focus on protecting radiators,
capacitors and other components
Tool Configuration:
加热喷嘴选:BGA+2-5mm
Large PCBs need to be supported.
Preferred plate center support point
Do not rely on component support
3.2 Consideration of temperature curve
setting Due to the influence of many factors on temperature, every repair
operation needs to:
Prioritize the use of historical curve
data
No data is required for field testing.
• Use the same rework plate as the test
board
Fix the thermocouple drill hole to the
solder ball.
Curve Type Selection:
A triangular tent curve is recommended.
• Heating rate< 3°C/sec
• Cooling rate<5°C/sec
○ Key control:
The bottom of the PCB is preheated to
prevent deformation
• Comply with the melting point
temperature
By rephrasing, the article:
1. The total score structure is more
logical.
2. Highlight key points and improve
reading fluency.
3. Simplify the expression of technical
terms
4. Operation Tips: Key Reminders
5. Optimized the aesthetics of
typography
If you would like to elaborate more on a
specific aspect, please feel free to let me know your specific requirements.
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id | '304' |
catid | '5' |
title | 'Talking about the repair of BGA' |
thumb | '824' |
keywords | 'BGA solder balls,Chips are planted tin' |
description | 'BGADetailed Explanation and Rework Tips</o:p>1. Basic knowledge: BGA (Ball Grid ArrayPackage) techno' |
hits | '1' |
uid | '1' |
author | '创始人' |
status | '9' |
url | '/news/304.html' |
link_id | '0' |
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inputip | '61.177.40.34-12138' |
inputtime | '2025-04-22 08:10:57' |
updatetime | '2025-04-22 08:10:57' |
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content | '<p class="MsoNormal"><b><span lang="EN-US" style="font-family:"Times New Roman",serif">BGA Detailed Explanation and Rework Tips</span><span lang="EN-US"><o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">1. Basic knowledge: BGA (Ball Grid Array Package) technology involves placing circular or cylindrical solder joints in an array on the bottom of the chip. Unlike traditional chip packaging, BGA packaging is unique in that its solder joints are completely hidden under the chip, which gives it the following advantages:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Higher density pinouts<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Better electrothermal performance<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Complex rework process<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">2.1 PBGA (Plastic Package)<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Advantages: low cost, easy processing</span></b></p><p class="MsoNormal"><img title="0055" alt="0055" src="/uploadfile/202502/6876bf522853d02.jpg" style="width: 50%;"><br></p><p class="MsoNormal"><b><span lang="EN-US">○ Features:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">• Melting point of conventional solder: 183°C for leaded type and 217°C for lead-free type.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Pay attention to moisture<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">2.2 CBGA<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Advantages: moisture-proof, stable<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">○ Features:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">High melting point solder balls (90% lead and 10% tin)<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">The diameter of the solder ball is 0.889mm<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">No solder residue.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">[Analysis of the repair process]<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">1. Key steps of rework 3.1 Preparation for pretreatment - pay attention to the tip: the preparation at this stage will be directly related to the efficiency of the rework job!<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Drying process (key link):<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">CRITICAL STEP: Be sure to thoroughly remove residual moisture from the chip and board<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">○ Operation Specifications:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">After baking, the follow-up process is completed within 24 hours.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">• Temperature-sensitive components, such as batteries and optical fibers, must be removed beforehand.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Protective measures:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">The repair area must be protected within 10mm.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">• Seal with 5-6 layers of high-temperature tape<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">• Focus on protecting radiators, capacitors and other components<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Tool Configuration:<o:p></o:p></span></b></p><p class="MsoNormal"><b>加热喷嘴选:<span lang="EN-US">BGA+2-5mm<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Large PCBs need to be supported.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Preferred plate center support point<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Do not rely on component support<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">3.2 Consideration of temperature curve setting Due to the influence of many factors on temperature, every repair operation needs to:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Prioritize the use of historical curve data<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">No data is required for field testing.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">• Use the same rework plate as the test board<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Fix the thermocouple drill hole to the solder ball.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">Curve Type Selection:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">A triangular tent curve is recommended.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">• Heating rate< 3°C/sec<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">• Cooling rate<5°C/sec<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">○ Key control:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">The bottom of the PCB is preheated to prevent deformation<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">• Comply with the melting point temperature<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">By rephrasing, the article:<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">1. The total score structure is more logical.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">2. Highlight key points and improve reading fluency.<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">3. Simplify the expression of technical terms<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">4. Operation Tips: Key Reminders<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">5. Optimized the aesthetics of typography<o:p></o:p></span></b></p><p class="MsoNormal"><b><span lang="EN-US">If you would like to elaborate more on a specific aspect, please feel free to let me know your specific requirements.<o:p></o:p></span></b></p><p class="MsoNormal"><span lang="EN-US" style="font-size:7.5pt;font-family:"微软雅黑",sans-serif; mso-bidi-font-family:微软雅黑;color:black;mso-font-kerning:0pt"> </span></p><p class="MsoNormal" align="left" style="margin: 1.5pt 0cm 4.5pt 3pt;"><span lang="EN-US"> </span></p><p> </p><p class="MsoNormal"><span lang="EN-US"> </span></p>' |
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meta_title | ' lead-free solder paste, halogen-free solder paste, environmentally friendly solder paste, silver containi' |
meta_keywords | 'Lead solder paste, lead-free solder paste, silver containing solder paste, lead-free solder paste, halogen-free solder paste, environmentally friendly solder paste, lead-free solder paste, halogen-free solder paste, no cleaning solder paste, metal cleaning agent, industrial cleaning agent, tile cleaning agent, photovoltaic panel cleaning agent, ink hole opening agent, paint remover, water-based cleaning agent, glue remover, anhydrous ethanol, thinner, lead-free solder wire, halogen-free solder wire, solder bar, silver containing solder wire, solder bar, three proof paint ' |
meta_description | 'Our company is a subsidiary of Taiwans Nofel Group, established in Suzhou, Jiangsu in 2006. We are a high-tech company specializing in the research and development, production, and sales of precision electronic welding materials. Our companys main products include: optical glass thin cleaning agent series, PCB board Post weld cleaning series, photovoltaic panel cleaning agent, electronic flux, solder paste, solder wire, solder bar, ethanol, hole opening agent, paint stripping agent, adhesive remover, degreasing and wax removal cleaning system for surface and processing suitability of various Yingjin rings Column, various plastic, chip, silk screen pre - and post cleaning texture series, photovoltaic industry cleaning series Column and other products. Our companys production equipment is imported from the United States or Germany, and production strictly follows the According to the 1S09001 quality system standard, the product parameters comply with Chinese national standards GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM- The testing of 650 and other standards can be comparable to internationally renowned enterprise Lai products. Meanwhile, the company We have advanced product testing and instruments, as well as multiple high-level professionals with doctoral and masters degrees Senior engineers and researchers, with long-term partnerships with 12 universities and research institutions both domestically and internationally Create a complete system.' |
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BaiduTransApi.php | FCPATH/App/Synlang/Models/BaiduTransApi.php |
BaseBuilder.php | APPPATH/System/Database/BaseBuilder.php |
BaseCollector.php | APPPATH/System/Debug/Toolbar/Collectors/BaseCollector.php |
BaseConfig.php | APPPATH/System/Config/BaseConfig.php |
BaseConnection.php | APPPATH/System/Database/BaseConnection.php |
BaseHandler.php | APPPATH/System/Cache/Handlers/BaseHandler.php |
BaseResult.php | APPPATH/System/Database/BaseResult.php |
BaseService.php | APPPATH/System/Config/BaseService.php |
Builder.php | APPPATH/System/Database/MySQLi/Builder.php |
Cache.php | APPPATH/Config/Cache.php |
Cache.php | APPPATH/Extend/Cache.php |
Cache.php | FCPATH/App/Synlang/Models/Cache.php |
Cache.php | FCPATH/Fcms/Library/Cache.php |
Cache.php | FCPATH/Fcms/Model/Cache.php |
CacheFactory.php | APPPATH/System/Cache/CacheFactory.php |
CacheInterface.php | APPPATH/System/Cache/CacheInterface.php |
Category.php | FCPATH/App/Module/Action/Category.php |
CliRenderer.php | APPPATH/System/ThirdParty/Kint/Renderer/CliRenderer.php |
CodeIgniter.php | APPPATH/Extend/CodeIgniter.php |
CodeIgniter.php | APPPATH/System/CodeIgniter.php |
Common.php | APPPATH/System/Common.php |
Config.php | APPPATH/System/Config/Config.php |
Config.php | APPPATH/System/Database/Config.php |
Connection.php | APPPATH/System/Database/MySQLi/Connection.php |
ConnectionInterface.php | APPPATH/System/Database/ConnectionInterface.php |
Constants.php | APPPATH/Config/Constants.php |
Content.php | FCPATH/App/Module/Models/Content.php |
Content.php | FCPATH/Fcms/Model/Content.php |
ContentSecurityPolicy.php | APPPATH/Config/ContentSecurityPolicy.php |
ContentSecurityPolicy.php | APPPATH/System/HTTP/ContentSecurityPolicy.php |
Controller.php | APPPATH/Extend/Controller.php |
Controller.php | APPPATH/System/Controller.php |
Database.php | APPPATH/Config/Database.php |
Database.php | APPPATH/System/Database/Database.php |
Database.php | APPPATH/System/Debug/Toolbar/Collectors/Database.php |
Date.php | FCPATH/Fcms/Field/Date.php |
DebugToolbar.php | APPPATH/System/Filters/DebugToolbar.php |
DotEnv.php | APPPATH/System/Config/DotEnv.php |
Editor.php | FCPATH/Fcms/Field/Editor.php |
Events.php | APPPATH/Config/Events.php |
Events.php | APPPATH/System/Debug/Toolbar/Collectors/Events.php |
Events.php | APPPATH/System/Events/Events.php |
Exceptions.php | APPPATH/Config/Exceptions.php |
Exceptions.php | APPPATH/Extend/Exceptions.php |
Exceptions.php | APPPATH/System/Debug/Exceptions.php |
Factories.php | APPPATH/System/Config/Factories.php |
Factory.php | APPPATH/System/Config/Factory.php |
Field.php | FCPATH/Fcms/Library/Field.php |
File.php | FCPATH/Fcms/Field/File.php |
FileHandler.php | APPPATH/System/Cache/Handlers/FileHandler.php |
FileLocator.php | APPPATH/System/Autoloader/FileLocator.php |
Files.php | APPPATH/System/Debug/Toolbar/Collectors/Files.php |
FilterInterface.php | APPPATH/System/Filters/FilterInterface.php |
Filters.php | APPPATH/Config/Filters.php |
Filters.php | APPPATH/System/Filters/Filters.php |
Filters.php | FCPATH/App/Module/Config/Filters.php |
Header.php | APPPATH/System/HTTP/Header.php |
Helper.php | FCPATH/Fcms/Core/Helper.php |
Hook.php | APPPATH/Extend/Hook.php |
Hooks.php | FCPATH/App/Bdts/Config/Hooks.php |
Hooks.php | FCPATH/App/Module/Config/Hooks.php |
Hooks.php | FCPATH/App/Synlang/Config/Hooks.php |
Hooks.php | FCPATH/Fcms/Core/Hooks.php |
HtmlTranslator.php | FCPATH/App/Synlang/Models/HtmlTranslator.php |
IncomingRequest.php | APPPATH/System/HTTP/IncomingRequest.php |
Init.php | APPPATH/Init.php |
Init.php | FCPATH/Fcms/Init.php |
Input.php | FCPATH/Fcms/Library/Input.php |
Kint.php | APPPATH/Config/Kint.php |
Kint.php | APPPATH/System/ThirdParty/Kint/Kint.php |
Lang.php | FCPATH/Fcms/Library/Lang.php |
Logger.php | APPPATH/Config/Logger.php |
Logger.php | APPPATH/System/Log/Logger.php |
LoggerInterface.php | APPPATH/System/ThirdParty/PSR/Log/LoggerInterface.php |
Logs.php | APPPATH/System/Debug/Toolbar/Collectors/Logs.php |
Member.php | FCPATH/Fcms/Model/Member.php |
Message.php | APPPATH/System/HTTP/Message.php |
MessageInterface.php | APPPATH/System/HTTP/MessageInterface.php |
MessageTrait.php | APPPATH/System/HTTP/MessageTrait.php |
Model.php | APPPATH/Extend/Model.php |
Model.php | FCPATH/Fcms/Core/Model.php |
Module.php | FCPATH/App/Module/Extends/Home/Module.php |
Module_init.php | FCPATH/App/Module/Config/Module_init.php |
Modules.php | APPPATH/Config/Modules.php |
Modules.php | APPPATH/System/Modules/Modules.php |
Paths.php | APPPATH/Config/Paths.php |
Phpcmf.php | FCPATH/Fcms/Core/Phpcmf.php |
Query.php | APPPATH/System/Database/Query.php |
QueryInterface.php | APPPATH/System/Database/QueryInterface.php |
Renderer.php | APPPATH/System/ThirdParty/Kint/Renderer/Renderer.php |
RendererInterface.php | APPPATH/System/View/RendererInterface.php |
Request.php | APPPATH/Extend/Request.php |
Request.php | APPPATH/System/HTTP/Request.php |
RequestInterface.php | APPPATH/System/HTTP/RequestInterface.php |
RequestTrait.php | APPPATH/System/HTTP/RequestTrait.php |
Response.php | APPPATH/System/HTTP/Response.php |
ResponseInterface.php | APPPATH/System/HTTP/ResponseInterface.php |
ResponseTrait.php | APPPATH/System/API/ResponseTrait.php |
ResponseTrait.php | APPPATH/System/HTTP/ResponseTrait.php |
Result.php | APPPATH/System/Database/MySQLi/Result.php |
ResultInterface.php | APPPATH/System/Database/ResultInterface.php |
RichRenderer.php | APPPATH/System/ThirdParty/Kint/Renderer/RichRenderer.php |
RouteCollection.php | APPPATH/System/Router/RouteCollection.php |
RouteCollectionInterface.php | APPPATH/System/Router/RouteCollectionInterface.php |
Router.php | APPPATH/System/Router/Router.php |
Router.php | FCPATH/Fcms/Library/Router.php |
RouterInterface.php | APPPATH/System/Router/RouterInterface.php |
Routes.php | APPPATH/Config/Routes.php |
Routes.php | APPPATH/Extend/Routes.php |
Routes.php | APPPATH/System/Config/Routes.php |
Routes.php | APPPATH/System/Debug/Toolbar/Collectors/Routes.php |
Run.php | FCPATH/App/Module/Config/Run.php |
SaveDbAndCache.php | FCPATH/App/Synlang/Models/SaveDbAndCache.php |
Security.php | FCPATH/Fcms/Library/Security.php |
Seo.php | FCPATH/Fcms/Library/Seo.php |
Service.php | FCPATH/Fcms/Core/Service.php |
Services.php | APPPATH/Config/Services.php |
Services.php | APPPATH/System/Config/Services.php |
Show.php | FCPATH/Fcms/Control/Show.php |
Text.php | FCPATH/Fcms/Field/Text.php |
TextRenderer.php | APPPATH/System/ThirdParty/Kint/Renderer/TextRenderer.php |
Textarea.php | FCPATH/Fcms/Field/Textarea.php |
Timer.php | APPPATH/System/Debug/Timer.php |
Timers.php | APPPATH/System/Debug/Toolbar/Collectors/Timers.php |
Toolbar.php | APPPATH/Config/Toolbar.php |
Toolbar.php | APPPATH/System/Debug/Toolbar.php |
URI.php | APPPATH/System/HTTP/URI.php |
UserAgent.php | APPPATH/System/HTTP/UserAgent.php |
UserAgents.php | APPPATH/Config/UserAgents.php |
Utils.php | APPPATH/System/ThirdParty/Kint/Utils.php |
Version.php | FCPATH/My/Config/Version.php |
View.php | APPPATH/Config/View.php |
View.php | APPPATH/Extend/View.php |
View.php | APPPATH/System/Config/View.php |
View.php | APPPATH/System/View/View.php |
View.php | FCPATH/Fcms/Core/View.php |
Views.php | APPPATH/System/Debug/Toolbar/Collectors/Views.php |
app_client.php | /www/wwwroot/49.235.147.58/cache/config/app_client.php |
app_client_seo.php | /www/wwwroot/49.235.147.58/cache/config/app_client_seo.php |
custom.php | /www/wwwroot/49.235.147.58/config/custom.php |
database.php | /www/wwwroot/49.235.147.58/config/database.php |
domain_app.php | /www/wwwroot/49.235.147.58/cache/config/domain_app.php |
domain_client.php | /www/wwwroot/49.235.147.58/cache/config/domain_client.php |
hooks.php | /www/wwwroot/49.235.147.58/config/hooks.php |
index.php | /www/wwwroot/49.235.147.58/index.php |
index.php | /www/wwwroot/49.235.147.58/ru/index.php |
init.php | APPPATH/System/ThirdParty/Kint/init.php |
init_helpers.php | APPPATH/System/ThirdParty/Kint/init_helpers.php |
lang.php | /www/wwwroot/49.235.147.58/api/language/zh-cn/lang.php |
rewrite.php | /www/wwwroot/49.235.147.58/config/rewrite.php |
site.php | /www/wwwroot/49.235.147.58/cache/config/site.php |
system.php | /www/wwwroot/49.235.147.58/cache/config/system.php |
template_DS_pc_DS_default_DS_home_DS_footer.html.cache.php | /www/wwwroot/49.235.147.58/cache/template/template_DS_pc_DS_default_DS_home_DS_footer.html.cache.php |
template_DS_pc_DS_default_DS_home_DS_header.html.cache.php | /www/wwwroot/49.235.147.58/cache/template/template_DS_pc_DS_default_DS_home_DS_header.html.cache.php |
template_DS_pc_DS_default_DS_home_DS_show_news.html.cache.php | /www/wwwroot/49.235.147.58/cache/template/template_DS_pc_DS_default_DS_home_DS_show_news.html.cache.php |
url_helper.php | APPPATH/System/Helpers/url_helper.php |
File: | {file} |
App: | |
Controller: | show |
Method: | index |
URI: | show/index |
URL: | https://www.fgh-sz.com/ru/news/304.html |
Time | Event Name | Times Called |
---|---|---|
11.78 ms | pre_system | 1 |
0.20 ms | dbquery | 6 |
Action | Datetime | Status | Method | URL | Content-Type | Is AJAX? |
---|---|---|---|---|---|---|
2025-05-25 21:43:23 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:43:12 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:40:19 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:31:51 | 200 | GET | https://49.235.147.58/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:28:19 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:25:14 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:24:19 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:23:52 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:23:51 | 200 | GET | https://fsbwnl1a.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:21:50 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:21:48 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | Yes | |
2025-05-25 21:19:34 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:18:22 | 200 | GET | https://ctkfmlvxyud.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:16:24 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:16:17 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | Yes | |
2025-05-25 21:15:56 | 200 | GET | https://www.fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:15:51 | 200 | GET | https://fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:15:48 | 200 | GET | https://fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:15:30 | 200 | GET | https://fgh-sz.com/ | text/html; charset=UTF-8 | No | |
2025-05-25 21:15:28 | 200 | GET | https://fgh-sz.com/ | text/html; charset=UTF-8 | No |
Session doesn't seem to be active.
c | show |
id | 304 |
m | index |
Priority | u=0, i |
Accept-Encoding | gzip, deflate, br, zstd |
Sec-Fetch-Dest | document |
Sec-Fetch-User | ?1 |
Sec-Fetch-Mode | navigate |
Sec-Fetch-Site | none |
Accept | text/html,application/xhtml+xml,application/xml;q=0.9,image/avif,image/webp,image/apng,*/*;q=0.8,application/signed-exchange;v=b3;q=0.7 |
User-Agent | Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com) |
Upgrade-Insecure-Requests | 1 |
Sec-Ch-Ua-Platform | "Windows" |
Sec-Ch-Ua-Mobile | ?0 |
Sec-Ch-Ua | "Chromium";v="130", "HeadlessChrome";v="130", "Not?A_Brand";v="99" |
Cache-Control | no-cache |
Pragma | no-cache |
Host | www.fgh-sz.com |
Priority | u=0, i |
Accept-Encoding | gzip, deflate, br, zstd |
Sec-Fetch-Dest | document |
Sec-Fetch-User | ?1 |
Sec-Fetch-Mode | navigate |
Sec-Fetch-Site | none |
Accept | text/html,application/xhtml+xml,application/xml;q=0.9,image/avif,image/webp,image/apng,*/*;q=0.8,application/signed-exchange;v=b3;q=0.7 |
User-Agent | Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com) |
Upgrade-Insecure-Requests | 1 |
Sec-Ch-Ua-Platform | "Windows" |
Sec-Ch-Ua-Mobile | ?0 |
Sec-Ch-Ua | "Chromium";v="130", "HeadlessChrome";v="130", "Not?A_Brand";v="99" |
Cache-Control | no-cache |
Pragma | no-cache |
Host | www.fgh-sz.com |
CodeIgniter Version: | 4.2.0 |
PHP Version: | 7.4.33 |
PHP SAPI: | fpm-fcgi |
Environment: | development |
Base URL: | https://www.fgh-sz.com/ |
Timezone: | PRC |
Locale: | en |
Content Security Policy Enabled: | No |