What is wire bonding?

Definition of Wire Bonding – What is Wire Bonding?

Wire bonding is a critical process in microelectronic packaging that connects chip pads to external substrates, lead frames, or other chip solder areas through metal filaments such as gold, aluminum, or copper wires to enable electrical interconnects. Its core principle is to use heat, pressure, or ultrasonic energy to cause atomic diffusion or electron sharing between the metal lead and the surface of the pad, forming an atomic-level bond. This process ensures reliable electrical signal transmission between the chip's internal circuitry and the external pins, making it an integral step in chip packaging.