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'彻底解决焊接锡珠的实用技巧'

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'芯片键合'

'本公司系臺灣諾菲爾集團公司麾下企業,是一家專業從事精密電子焊接材料研發、生産及銷售的高新技術公司,主要産品有:助焊劑、清洗劑、抹機水、絶緣漆、焊錫膏、焊錫條、焊錫綫等電子組裝焊接材料.咨询电话：+86'

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'创始人'

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'/news/286.html'

'0'

'0'

'61.177.40.34-11482'

'2025-03-11 08:30:26'

'2025-03-11 08:30:26'

'0'

'<p class="MsoNormal">一、【行业背景】在电子产品<span lang="EN-US">“</span>瘦身革命<span lang="EN-US">”</span>（追求更轻、更薄、更省电）的浪潮下，现代电子制造广泛运用高精密的贴片技术（<span lang="EN-US">SMT</span>）。然而，在这个指甲盖大小的焊点上，潜藏着一个不容忽视的隐患<span lang="EN-US">——</span>锡珠。这个在显微镜下才能看清的小不点，可能引发电路短路甚至设备起火等重大质量事故。下面是业内<span lang="EN-US">20</span>年的经验总结，带您深入了解这个虽小却关键的工艺难题。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">二、【锡珠的形成原理】想象一场微型的金属雨<span lang="EN-US" style="font-family:
&quot;Segoe UI Emoji&quot;,sans-serif;mso-bidi-font-family:&quot;Segoe UI Emoji&quot;">🌧️</span>：当电路板经过高温焊接时，被挤出的微量锡膏颗粒会在<span lang="EN-US">300℃</span>的炉膛里飞溅并凝固，最终形成直径<span lang="EN-US">0.2 - 0.4</span>毫米的金属小球（类似微型弹珠）。这些<span lang="EN-US">“</span>金属雨滴<span lang="EN-US">”</span>常常藏匿于芯片引脚间隙或贴片元件侧面，就像电子血管中的血栓一样危险。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">锡珠是由多种因素造成的，原材料、<a href="/solder_paste/" target="_blank"><font color="#ff0000">锡膏</font></a>、模板、装贴、回流焊、环境等都可能导致锡珠的产生。所以，研究其产生的原因并进行最有效的控制就显得尤为重要。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">&nbsp;</span>原材问题导致产生锡珠及其控制方法<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">三、【关键成因与解决方案】 基板处理<span lang="EN-US"> √ </span>焊接点位设计：焊盘溢出值是关键，建议采用正负<span lang="EN-US">5%</span>的配合公差。<span lang="EN-US">√</span>材质管控三部曲：阻焊膜达标检测<span lang="EN-US">→</span>板面清洁处理<span lang="EN-US">→</span>湿度监控（如图<span lang="EN-US">1</span>）。<span lang="EN-US">√</span>现场实例：某手机主板因阻焊膜脱落导致微短路，修复后产品故障率直降<span lang="EN-US">68%</span>。<span lang="EN-US">//</span>建议插入阻焊膜合格与不合格对比示意图<span lang="EN-US">//<o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US" style="font-family:&quot;Cambria Math&quot;,serif;
mso-bidi-font-family:&quot;Cambria Math&quot;">▶</span><span lang="EN-US"> </span>现场案例：代用元器件引发的连锁反应。当使用非标元器件时（如表<span lang="EN-US">1</span>对比示例），匹配度每降低<span lang="EN-US">10%</span>，锡珠发生率上升<span lang="EN-US">35%</span>。建议建立代用品分级评估机制。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">型号对比 标准品公差 代用品公差 风险值<span lang="EN-US">&nbsp; 0402</span>电容<span lang="EN-US"> ±0.1mm ±0.15mm
</span>高风险<span lang="EN-US">&nbsp; BGA</span>芯片<span lang="EN-US"> 0.05mm 0.12mm </span>中风险 <span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">原材料管理<span lang="EN-US"> ‖</span>锡膏选用金标准<span lang="EN-US">‖ •</span>金属组分：体积比<span lang="EN-US">50±2%</span>（乒乓球堆叠原理）<span lang="EN-US"> •</span>氧化程度：每增加<span lang="EN-US">0.5%</span>，焊接不良率翻倍。<span lang="EN-US"> •</span>颗粒分布：优选<span lang="EN-US">20 - 45μm</span>级<span lang="EN-US">&nbsp;•</span>活性保质：冷藏状态下保质期延长至<span lang="EN-US">8</span>个月。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US" style="font-family:&quot;Cambria Math&quot;,serif;
mso-bidi-font-family:&quot;Cambria Math&quot;">▶</span>工艺控制黑科技：<a href="https://www.fgh-sz.com" target="_blank"><font color="#ff0000">诺菲尔科技</font></a>开发的真空防氧化上料系统，使锡膏氧化率降低至行业<span lang="EN-US">1/3</span>水平。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">设备参数优化 《印刷调节三要素》<span lang="EN-US"> →</span>压力：黄金值<span lang="EN-US">0.4kg/cm²</span>（类比钢琴按键力度）<span lang="EN-US"> →</span>速度：<span lang="EN-US">25mm/s</span>标速下的正弦补偿算法<span lang="EN-US"> →</span>模板：厚度参数精准匹配系统（见公式推导）。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">制造环境 说明：温度每波动<span lang="EN-US">5℃ = </span>黏度变化<span lang="EN-US">15%</span>，设置联动式环境补偿系统可稳定成品率。建议采用多点温湿度监控方案。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal" style="margin-left:0cm;text-indent:0cm;mso-list:l0 level1 lfo1"><span lang="EN-US">1.PCB</span>质量、元器件<span lang="EN-US"> PCB</span>的焊盘（<span lang="EN-US">PAD</span>）设计不合理，如果元器件本体过多压在<span lang="EN-US">PAD</span>上把锡膏挤出过多，可能产生锡珠。在设计<span lang="EN-US">PCB</span>时，就要选定合适的元器件封装及合适的<span lang="EN-US">PAD</span>。<span lang="EN-US"> PCB</span>阻焊膜印刷不好、表面粗糙，导致回流时出现锡珠，必须加严<span lang="EN-US">PCB</span>来料入检，阻焊膜严重不良时，必须批退或报废处理。 焊盘有水份或污物，导致产生锡珠，必须仔细清除<span lang="EN-US">PCB</span>上的水份或污物，再投入生产。 另外，经常会遇到客户来料为不同封装尺寸器件的代用要求，导致器件和<span lang="EN-US">PAD</span>不匹配，易产生锡珠，因此应尽量避免代用。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal" style="margin-left:0cm;text-indent:0cm;mso-list:l0 level1 lfo1"><span lang="EN-US">2.PCB</span>受潮<span lang="EN-US"> PCB</span>中水分过多，贴装后过回流炉时，由于水分急剧膨胀产生气体，从而产生锡珠。要求<span lang="EN-US">PCB</span>在投入<span lang="EN-US">SMT</span>生产前必须是干燥真空包装，如有受潮需要用烘箱烘烤后使用。对于有机保焊膜（<span lang="EN-US">OSP</span>）板，不允许烘烤。依生产周期算，<span lang="EN-US">OSP</span>板未超<span lang="EN-US">3</span>月可上线生产，超<span lang="EN-US">3</span>月则需换料。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal" style="margin-left:0cm;text-indent:0cm;mso-list:l0 level1 lfo1">3.锡膏选用 锡膏对焊接质量影响显著，锡膏中的金属含量、氧化物含量、金属粉末粒度、锡膏活性等都不同程度地影响着锡珠的形成。琟金属含量、黏度。正常情况下，锡膏中金属含量的体积比约为<span lang="EN-US">50</span>％左右、质量比约为<span lang="EN-US">89</span>％<span lang="EN-US"> - 91</span>％，其余为<a href="/Welding_Additives/" target="_blank"><font color="#ff0000">助焊剂</font></a>（<span lang="EN-US">Flux</span>）、流变性调节剂、黏度控制剂、溶剂等。如果助焊剂比例过多，锡膏黏度降低，在预热区，助焊剂气化时产生的力过大，易产生锡珠。
锡膏黏度是影响印刷性能的重要因素，通常在<span lang="EN-US">0.5 - 1.2 KPa·s</span>之间，模板印刷时，锡膏黏度最佳约为<span lang="EN-US">0.8 KPa·s</span>。金属含量增加时，锡膏黏度增加，能更有效地抵抗预热区中气化产生的力，也可减小锡膏印刷后塌落趋势，从而减少锡珠。
氧化物含量。锡膏中氧化物含量也影响焊接效果。氧化物含量越高，金属粉末熔化后结合过程中所受阻力就越大，回流焊阶段，金属粉末表面氧化物含量还会增高，不利于焊盘<span lang="EN-US">“</span>润湿<span lang="EN-US">”</span>而产生锡珠。因此在金属粉末（<span lang="EN-US">Powder</span>）制程中须要求真空化操作，防止<span lang="EN-US">Powder</span>氧化。 金属粉末的粒度、均匀性。金属粉末是极细小的球状颗粒，其形状、直径大小及均匀性均影响其印刷性能。较细的颗粒中氧化物含量较高，如果细颗粒比例大，会有更好的印刷清晰度，但却易产生塌边，使锡珠增多；较大的颗粒比例大，会使连锡增多，其均匀度相差大，会导致锡珠增多。
锡膏活性。锡膏活性不好，干得太快，如果加了过量稀释剂，在预热区，稀释剂气化产生的力过大，易产生锡珠。如果遇到活性不好的锡膏，最好马上停用更换活性好的。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">模板问题导致产生锡珠及其控制方法<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">四、【全流程管控体系】构建<span lang="EN-US">“</span>预防<span lang="EN-US"> - </span>检测<span lang="EN-US"> - </span>改善<span lang="EN-US">”</span>的闭环：
预防体系：<span lang="EN-US">55</span>项标准化作业规范。 实时监测：激光检测设备<span lang="EN-US"> + AI</span>图像识别。
追溯改进：建立焊接质量数据库（案例：<span lang="EN-US">Z</span>工厂通过<span lang="EN-US">SPC</span>系统使锡珠缺陷减少<span lang="EN-US">92%</span>）。</p><p class="MsoNormal"><img title="002" alt="002" src="/uploadfile/202503/7179aa8c86cbe67.jpg"><span lang="EN-US"><o:p><br></o:p></span></p><p class="MsoNormal"><span lang="EN-US"><o:p><br></o:p></span></p><p class="MsoNormal">五、【创新突破】<span lang="EN-US" style="font-family:&quot;Cambria Math&quot;,serif;
mso-bidi-font-family:&quot;Cambria Math&quot;">▶</span>目前行业前沿：<span lang="EN-US"> •</span>纳米级焊点<span lang="EN-US">CT</span>扫描技术<span lang="EN-US"> •</span>自修复焊料研发（实验室阶段）<span lang="EN-US"> •AI</span>动态温控算法。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">模板太厚，锡膏印刷就厚，回流焊后易产生锡珠。 模板厚度选择原则：<span lang="EN-US"> / </span>如模板太厚导致锡珠多，尽快重新制作模板。
模板开孔未做防锡珠处理，易产生锡珠。无论有铅或无铅，印锡模板的<span lang="EN-US">Chip</span>件开孔均需防锡珠开孔。 模板开口不当、过大、偏移，都会导致锡珠产生。<span lang="EN-US">PAD</span>大小决定着模板开孔的大小，模板开口设计最关键的要素是尺寸、形状。为避免锡膏印刷过量，将开口尺寸设计成小于相应焊盘接触面积的<span lang="EN-US">10</span>％；无铅模板开口设计应比有铅的大一些，使锡膏尽可能完全覆盖焊盘。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">1.</span>印刷机参数设定调整不当导致产生锡珠及其控制方法<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">印刷完后锡膏有塌边现象，过回流炉后可能形成锡珠。锡膏有塌边，这和印刷机刮刀压力、速度、脱模速度有关系。如有锡膏塌边现象，需重新调整刮刀压力、速度或脱模速度，减轻塌边，减少锡珠发生。
未对好位就开始印刷，印刷偏移，使部分锡膏沾到<span lang="EN-US">PCB</span>上，可能形成锡珠。<span lang="EN-US"> PAD</span>上印刷锡膏过厚，元件下压后多余锡膏溢流，易形成锡珠。锡膏印刷厚度是生产中一个主要参数，通常等于模板厚度的（<span lang="EN-US">1 + 10%±15%</span>）之间，过厚导致塌边易形成锡珠。 印刷厚度是由模板厚度所决定，与机器的设定和锡膏特性有一定关系。印刷厚度的微量调整，经常是通过调节刮刀压力及印刷速度来实现。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">2.</span>置件压力问题导致产生锡珠及其控制方法<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">如果贴片中置件压力设定过大，当元件压在锡膏上时，就可能有一部分锡膏被挤在元件下面，回流焊阶段，这部分锡膏熔化易形成锡珠，因此应选择适当的置件压力。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">/</span>炉温问题导致产生锡珠及其控制方法<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">回流焊曲线可分为预热、保温、回流和冷却四个阶段。预热阶段升温到<span lang="EN-US">120 - 150</span>度之间，可除去锡膏中易挥发的溶剂，减少对元件的热振动；同时锡膏内部会发生气化现象，如果锡膏中金属粉末之间的粘结力小于气化产生的力，就会有少量锡膏从<span lang="EN-US">PAD</span>上溢流离开，有的则躲到片状阻容件下面，回流后形成锡珠。 由此可见，预热温度越高、预热区升温越急，就会加大气化现象飞溅，就越容易形成锡珠。因此要调整回流炉温、降低输送带速度，采取较适中的预热温度和预热速度来控制锡珠。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">3.</span>制程管控问题导致产生锡珠及其控制方法<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">锡膏使用注意事项主要包括以下几个方面：在规定的保存条件下，锡膏存储期限一般为<span lang="EN-US">3 - 6</span>个月；<a href="/solder_paste/" target="_blank"><font color="#ff0000">锡膏</font></a>使用应遵循<span lang="EN-US">“</span>先进先出<span lang="EN-US">”</span>原则，应以密封形式保存在恒温冰箱内，温度在<span lang="EN-US">2℃ - 10℃</span>；使用前，从冰箱中取出、密封置于室温下至少回温<span lang="EN-US">4H</span>，待锡膏达到室温时打开瓶盖，取出部分锡膏后，将里面的盖子与锡膏之间空气全部挤净，立即盖好外盖。若在低温开瓶，易吸收水汽，再流焊时易产生锡珠；
开封后应按要求搅拌均匀，降低锡膏黏度，开盖后原则上应在当天内一次用完；锡膏置于模板上超过<span lang="EN-US">30</span>分钟未使用时，应用印刷机的搅拌功能搅拌后再使用，若间隔时间较长（超过<span lang="EN-US">1H</span>），应将锡膏重新放回罐中盖紧瓶盖，再次使用应搅拌均匀；从模板收掉锡膏时，要换另一个空罐装，防止污染新鲜锡膏，从模板上刮回的锡膏也应密封冷藏。
制程管理也有其相应的要求：印刷时的最佳温度为<span lang="EN-US">25℃±3℃</span>，相对湿度为<span lang="EN-US">45%
- 65%</span>，温湿度过高，锡膏容易吸收水汽，回流时易产生锡珠；印刷失败后，最好用超声波清洗设备彻底清洗<span lang="EN-US">PCB</span>，晾干后再放入烘箱按规范烘烤，以防止再使用时出现锡珠；清洁模板不及时、或擦拭不彻底，导致模板背面有残余锡膏，污染<span lang="EN-US">PCB</span>板面，产生锡珠。必须严格按照模板清洁规范操作，确定专人清洁、检查；印刷锡膏后，<span lang="EN-US">PCB</span>应在尽可能短的时间内贴装完，以防止助焊剂等溶剂挥发，易产生锡珠。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">在<span lang="EN-US">SMT</span>生产中，产生锡珠的因素众多，只关注某一方面或调整某一项参数是远远不够的。我们需要在生产前的准备阶段和生产过程中仔细管控好各个细节，研究如何控制影响锡珠的各项因素，从而使焊接达到最佳效果，满足电子连技术的高质量要求。<span lang="EN-US"><o:p></o:p></span></p><p>





















































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  'title' => '焊接锡珠从何而来？如何有效解决？',
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' lead-free solder paste, halogen-free solder paste, environmentally friendly solder paste, silver containi'

'Lead solder paste, lead-free solder paste, silver containing solder paste, lead-free solder paste, halogen-free solder paste, environmentally friendly solder paste, lead-free solder paste, halogen-free solder paste, no cleaning solder paste, metal cleaning agent, industrial cleaning agent, tile cleaning agent, photovoltaic panel cleaning agent, ink hole opening agent, paint remover, water-based cleaning agent, glue remover, anhydrous ethanol, thinner, lead-free solder wire, halogen-free solder wire, solder bar, silver containing solder wire, solder bar, three proof paint
'

'Our company is a subsidiary of Taiwans Nofel Group, established in Suzhou, Jiangsu in 2006. We are a high-tech company specializing in the research and development, production, and sales of precision electronic welding materials.
Our companys main products include: optical glass thin cleaning agent series, PCB board
Post weld cleaning series, photovoltaic panel cleaning agent, electronic flux, solder paste, solder wire, solder bar, ethanol, hole opening agent, paint stripping agent, adhesive remover, degreasing and wax removal cleaning system for surface and processing suitability of various Yingjin rings
Column, various plastic, chip, silk screen pre - and post cleaning texture series, photovoltaic industry cleaning series
Column and other products.
Our companys production equipment is imported from the United States or Germany, and production strictly follows the
According to the 1S09001 quality system standard, the product parameters comply with Chinese national standards
GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM-
The testing of 650 and other standards can be comparable to internationally renowned enterprise Lai products. Meanwhile, the company
We have advanced product testing and instruments, as well as multiple high-level professionals with doctoral and masters degrees
Senior engineers and researchers, with long-term partnerships with 12 universities and research institutions both domestically and internationally
Create a complete system.'

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GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM-
The testing of 650 and other standards can be comparable to internationally renowned enterprise Lai products. Meanwhile, the company
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GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM-
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Post weld cleaning series, photovoltaic panel cleaning agent, electronic flux, solder paste, solder wire, solder bar, ethanol, hole opening agent, paint stripping agent, adhesive remover, degreasing and wax removal cleaning system for surface and processing suitability of various Yingjin rings
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GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM-
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