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'BGA芯片的拆焊技巧'

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'本公司系臺灣諾菲爾集團公司麾下企業,是一家專業從事精密電子焊接材料研發、生産及銷售的高新技術公司,主要産品有:助焊劑、清洗劑、抹機水、絶緣漆、焊錫膏、焊錫條、焊錫綫等電子組裝焊接材料.咨询电话：+86'

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'61.177.40.34-12476'

'2025-03-16 08:30:50'

'2025-03-16 08:30:50'

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'<p class="MsoNormal">（一）<span lang="EN-US"> BGA</span>芯片的拆卸<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">① </span>做好元件保护工作。在拆卸<span lang="EN-US">BGA
IC</span>时，要留意是否会影响到周边元件，有些手机的字库、暂存、<span lang="EN-US">CPU</span>靠得很近。拆焊时，可在邻近的<span lang="EN-US">IC</span>上放置浸水的棉团。许多塑料功放、软封装的字库耐高温能力差，吹焊时温度不能过高，否则很容易将其吹坏。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">② </span>在待拆卸的<span lang="EN-US">IC</span>上放置适量助焊剂，并尽量吹入<span lang="EN-US">IC</span>底部，这样能使芯片下的焊点均匀熔化。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">③ </span>调节热风枪的温度和风力，一般温度设为<span lang="EN-US">3 - 4</span>档，风力设为<span lang="EN-US">2 - 3</span>档，风嘴在芯片上方<span lang="EN-US">3cm</span>左右移动加热，直至芯片底下的锡珠完全熔化，然后用镊子夹起整个芯片。注意：加热<span lang="EN-US">IC</span>时要吹<span lang="EN-US">IC</span>四周，不要吹<span lang="EN-US">IC</span>中间，否则容易使<span lang="EN-US">IC</span>隆起；加热时间不要过长，否则会使电路板起泡。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">④ BGA</span>芯片取下后，芯片的焊盘和机板上都会有余锡。此时，在线路板上加足量助焊膏，用电烙铁去除板上多余的焊锡，并且可以适当上锡，使线路板的每个焊脚都光滑圆润，然后再用天那水清洗芯片和机板上的<a href="/Welding_Additives/86.html" target="_blank"><font color="#ff0000">助焊剂</font></a>，除焊锡时要格外小心，否则会刮掉焊盘上面的绿漆或者使焊盘脱落。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">（二） 植锡<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">① </span>做好准备工作。将<span lang="EN-US">IC</span>表面的焊锡清除干净后，可在<span lang="EN-US">BGA IC</span>表面加上适量助焊膏，用电烙铁去除<span lang="EN-US">IC</span>上过多的焊锡，然后把<span lang="EN-US">IC</span>放入天那水中洗净，洗净后检查<span lang="EN-US">IC</span>焊点是否光亮，如果部分氧化，需用电烙铁加上助焊剂和焊锡，使其光亮，以便植锡。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">② BGA IC</span>的固定方法有多种，下面介绍两种实用方便的方法： 贴标签纸固定法：将<span lang="EN-US">IC</span>对准植锡板的孔，用标签贴纸将<span lang="EN-US">IC</span>与植锡板贴紧，<span lang="EN-US">IC</span>对准后，用手或镊子按住植锡板不动，然后另一只手刮浆上锡。 在<span lang="EN-US">IC</span>下面垫餐巾纸固定法：在<span lang="EN-US">IC</span>下面垫几层纸巾，然后把植锡板孔与<span lang="EN-US">IC</span>脚对准放上，用手或镊子按住植锡板，然后刮锡浆。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">③ </span>上锡浆。如果锡浆太稀，吹焊时容易沸腾，导致成球困难，所以锡浆越干越好，只要不是干得发硬成块就行，如果太稀，可以用餐巾纸压一压吸干一点。平时可以挑一些锡浆放在锡浆内盖上，让其自然晾干一点。用平口刀挑适量锡浆到植锡板上，用力往下刮，边刮边压，使锡浆均匀地填充植锡板的小孔。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">④ </span>把热风枪风力调小至<span lang="EN-US">2</span>档，晃动风嘴对着植锡板缓缓均匀加热，使锡浆慢慢熔化。当看到植锡板的个别小孔中已有锡球生成时，说明温度已经合适，这时应当抬高热风枪，避免温度继续上升。过高的温度会使锡浆剧烈沸腾，导致植锡失败，严重的还会使<span lang="EN-US">IC</span>过热损坏。如果吹焊成功后发现有些锡球大小不均匀，甚至个别没有上锡，可以先用刮刀沿着植锡板表面将过大锡球的露出部分削平，再用刮起刀将锡球过小和缺脚的小孔中上满锡浆，然后再用热风枪吹一次即可。如果锡球大小仍然不均匀，重复上述操作直至达到理想状态。重植时，必须将植锡板清洗干净并擦干。取植锡板时，趁热用镊子尖在<span lang="EN-US">IC</span>四个角向下压一下，这样就更容易取下。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">（三）<span lang="EN-US"> BGA</span>芯片的安装<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">① </span>先在<span lang="EN-US">BGA IC</span>有焊脚的那一面涂上适量助焊膏，热风枪温度调到<span lang="EN-US">2</span>档轻轻吹一吹，使助焊膏均匀分布于<span lang="EN-US">IC</span>的表面，从而定位<span lang="EN-US">IC</span>的锡珠为焊接作准备。然后将热风枪温度调到<span lang="EN-US">3</span>档，先加热机板，吹熔助焊剂。再将植好锡珠的<span lang="EN-US">BGA IC</span>按照拆卸前的位置放到线路板上，同时，用手或镊子将<span lang="EN-US">IC</span>前后左右移动并轻轻加压，这时可以感觉到两边焊脚的接触情况。对准后，因为事先在<span lang="EN-US">IC</span>脚上涂了一点助焊膏，有一定粘性，<span lang="EN-US">IC</span>不会移动。如果位置偏了，要重新定位。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">② BGA IC</span>定位好后，就可以焊接了。和植锡球时一样，调节热风枪至合适的风量和温度，让风嘴的中央对准<span lang="EN-US">IC</span>的中央位置，缓缓加热。当看到<span lang="EN-US">IC</span>往下一沉且四周有助焊膏溢出时，说明锡球已和线路板上的焊点熔合在一起。这时可以轻轻晃动热风枪使加热均匀充分，由于表面张力的作用，<span lang="EN-US">BGA IC</span>与线路板的焊点之间会自动对准定位。注意在加热过程中切勿用力按<span lang="EN-US">BGA</span>，否则会使焊锡外溢，极易造成脱脚和短路。焊接完成后用天那水将板清洗干净即可。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">（四） 带胶<span lang="EN-US">BGA</span>芯片的拆卸方法<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">目前不少品牌手机的<span lang="EN-US">BGA IC</span>都灌了封胶，拆卸时更加困难，下面详细介绍针对这类<span lang="EN-US">IC</span>的拆卸去胶技巧。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">对于摩托罗拉手机的封胶，市面上有许多品牌的溶胶水可以方便地去胶，经多次实验发现<span lang="EN-US">V998</span>的<span lang="EN-US">CPU</span>用香蕉水浸泡，去胶效果较好，一般浸泡<span lang="EN-US">3 - 4</span>小时，封胶就容易去掉了。需要注意的是：<span lang="EN-US">V998</span>手机浸泡前一定要把字库取下，否则字库会损坏。因为<span lang="EN-US">998</span>字库是软封装的<span lang="EN-US">BGA</span>，不能用香蕉水、天那水或溶胶水浸泡，这些溶剂对软封装的<span lang="EN-US">BGA</span>字库中的胶有较强的腐蚀性，会使胶膨胀导致字库报废。当然，如果没有溶胶水，也可直接拆卸，摩托罗拉的封胶耐温低，易软化，而<span lang="EN-US">CPU</span>比较耐高温，只要注意方法，也可成功拆卸。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">① </span>先将热风枪的风速及温度调到适当位置（一般风量<span lang="EN-US">3</span>档、热量<span lang="EN-US">4</span>档，可根据不同品牌热风枪自行调整）<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">② </span>将热风在<span lang="EN-US">CPU</span>上方<span lang="EN-US">5cm</span>处移动吹，大约半分钟后，用一小刀片从<span lang="EN-US">CPU</span>接地脚较多的方向下手，一般从第一脚，也就是暂存器上方开始撬，注意热风不能停。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">③ CPU</span>拆下来后，接着就是除胶，用热风枪一边吹，一边小心地用小刀慢慢地一点一点地刮，直到焊盘上干净为止。</p><p class="MsoNormal"><img title="005" alt="005" src="/uploadfile/202502/e0f5975585e1.jpg"><br></p><p class="MsoNormal">诺基亚手机的底胶最初采用特殊注塑，目前没有比较好的除胶方法，拆卸时要注意操作技巧：<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">① </span>固定机板，调节热风枪温度在<span lang="EN-US">270℃
- 300℃</span>之间，风量调大，以不吹移阻容元件为准，对所拆的<span lang="EN-US">IC</span>封胶预热<span lang="EN-US">20</span>秒左右，然后移动风枪，等机板变凉后再预热，共预热<span lang="EN-US">3</span>次，每次预热时都要加入油性较重的助焊剂，以便油质流入焊盘内起到保护作用。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">② </span>把热风枪温度调到<span lang="EN-US">350℃ -
400℃</span>之间，继续给<span lang="EN-US">IC</span>加热，一边加热一边用镊子轻压<span lang="EN-US">IC</span>，当看到<a href="/solder_sheets/272.html" target="_blank"><font color="#ff0000">锡珠</font></a>从封胶中挤出来时，便可以从元件较少的一方用镊子尖把边上的封胶挑几个洞，让锡珠流出来，记住这时仍要不停地放油质助焊剂。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal"><span lang="EN-US">③ </span>拆离<span lang="EN-US">IC</span>，当看到<span lang="EN-US">IC</span>下面不再有锡珠冒出时，用带弯钩的细尖镊子放入冒锡处的<span lang="EN-US">IC</span>底下，轻轻一挑就可拆下。<span lang="EN-US"><o:p></o:p></span></p><p class="MsoNormal">清理封胶，大多数的<span lang="EN-US">IC</span>拆下后，封胶都留在主板上，首先在主板上的锡点处放上助焊剂，用烙铁把封胶上的锡珠吸走，多吸几次，直至能清晰看到底部光亮的焊盘为止，主要作用是彻底让焊点和封胶分离。调节风枪温度在<span lang="EN-US">270℃ - 300℃</span>之间，对主板的封胶加热，这时封胶就基本上脱离了焊盘，看准焊点与焊点之间的安全地方用镊子挑，挑的力度要控制好，如果操作得当，一挑就可以取下一大片。对于<span lang="EN-US">IC</span>上的封胶清除速度不一样，先把<span lang="EN-US">IC</span>清洗一下，然后在<span lang="EN-US">IC</span>背面粘上双面胶，将其固定在拆焊台上，风枪温度仍调到<span lang="EN-US">270℃ - 300℃</span>之间，放上<a href="/Welding_Additives/86.html" target="_blank"><font color="#ff0000">助焊剂</font></a>，加热封胶，用镊子一挑就可清除。<span lang="EN-US"><o:p></o:p></span></p><p>















































</p><p class="MsoNormal"><span lang="EN-US">&nbsp;</span></p>'

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' lead-free solder paste, halogen-free solder paste, environmentally friendly solder paste, silver containi'

'Lead solder paste, lead-free solder paste, silver containing solder paste, lead-free solder paste, halogen-free solder paste, environmentally friendly solder paste, lead-free solder paste, halogen-free solder paste, no cleaning solder paste, metal cleaning agent, industrial cleaning agent, tile cleaning agent, photovoltaic panel cleaning agent, ink hole opening agent, paint remover, water-based cleaning agent, glue remover, anhydrous ethanol, thinner, lead-free solder wire, halogen-free solder wire, solder bar, silver containing solder wire, solder bar, three proof paint
'

'Our company is a subsidiary of Taiwans Nofel Group, established in Suzhou, Jiangsu in 2006. We are a high-tech company specializing in the research and development, production, and sales of precision electronic welding materials.
Our companys main products include: optical glass thin cleaning agent series, PCB board
Post weld cleaning series, photovoltaic panel cleaning agent, electronic flux, solder paste, solder wire, solder bar, ethanol, hole opening agent, paint stripping agent, adhesive remover, degreasing and wax removal cleaning system for surface and processing suitability of various Yingjin rings
Column, various plastic, chip, silk screen pre - and post cleaning texture series, photovoltaic industry cleaning series
Column and other products.
Our companys production equipment is imported from the United States or Germany, and production strictly follows the
According to the 1S09001 quality system standard, the product parameters comply with Chinese national standards
GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM-
The testing of 650 and other standards can be comparable to internationally renowned enterprise Lai products. Meanwhile, the company
We have advanced product testing and instruments, as well as multiple high-level professionals with doctoral and masters degrees
Senior engineers and researchers, with long-term partnerships with 12 universities and research institutions both domestically and internationally
Create a complete system.'

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GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM-
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GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM-
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Post weld cleaning series, photovoltaic panel cleaning agent, electronic flux, solder paste, solder wire, solder bar, ethanol, hole opening agent, paint stripping agent, adhesive remover, degreasing and wax removal cleaning system for surface and processing suitability of various Yingjin rings
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        'list_description' => 'Our company is a subsidiary of Taiwan\'s Nofel Group, established in Suzhou, Jiangsu in 2006. We are a high-tech company specializing in the research and development, production, and sales of precision electronic welding materials.
Our company\'s main products include: optical glass thin cleaning agent series, PCB board
Post weld cleaning series, photovoltaic panel cleaning agent, electronic flux, solder paste, solder wire, solder bar, ethanol, hole opening agent, paint stripping agent, adhesive remover, degreasing and wax removal cleaning system for surface and processing suitability of various Yingjin rings
Column, various plastic, chip, silk screen pre - and post cleaning texture series, photovoltaic industry cleaning series
Column and other products.
Our company\'s production equipment is imported from the United States or Germany, and production strictly follows the
According to the 1S09001 quality system standard, the product parameters comply with Chinese national standards
GB9491、 Japanese Industrial Standard JIS-Z-3197 and American J-STD-OO4, IPCTM-
The testing of 650 and other standards can be comparable to internationally renowned enterprise Lai products. Meanwhile, the company
We have advanced product testing and instruments, as well as multiple high-level professionals with doctoral and master\'s degrees
Senior engineers and researchers, with long-term partnerships with 12 universities and research institutions both domestically and internationally
Create a complete system.',
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